News


New ProFlow family members to debut at Productronica

24 October 2001 News

The latest additions to DEK's ProFlow product family will break cover at Productronica this November, reports the company.

First is a new dual chamber transfer head aimed at processes requiring high paste or adhesive deposition volume. It is joined by extensive wiper options and an enhanced 'paste low' sensor for greater paste utilisation. The dual chamber transfer head optimises the movement and conditioning of a large volume of paste or adhesive. Conditioning the material inside the head prior to deposition is critical to process control, and the dual chamber head now makes processes such as pin in paste, PumpPrinting and step-repeat patterns easier and more repeatable at line speed.

DEK said it will continue to offer the original single chamber head as the standard ProFlow configuration.

The broad selection of precision wipers, including stepped or flat titanium for use with metal stencils, or mylar for delicate surfaces such as emulsion screens and PumpPrint stencils, allows users to access the benefits of ProFlow DirEKt Imaging in many electronic applications.

The new ProFlow 'paste low' sensor reduces paste wastage and allows precise user control via a micrometer scale calibrated in 0,5 mm steps. Data from field trials has shown paste wastage can now be reliably maintained within 4% to 8% of the total cassette volume, claims DEK.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved