Cypress Semiconductor has introduced two series in its portfolio of flexible microcontrollers based on the ARM Cortex-M0+ core. The new FM0+ S6E1B series and S6E1C series microcontrollers (MCUs) deliver Cortex-M3/M4-class peripherals at a low, 40 µA/MHz active current consumption budget.
The S6E1B series features the industry’s largest memory size for a Cortex-M0+ device and supports highly reliable and secure machine-to-machine (M2M) communication for the Internet of Things, while the S6E1C series is optimised for wearables and a wide range of ultra-low-power, battery-powered products.
The processing and Flash architecture of the devices is optimised for high efficiency, enabling the family to achieve a 35 μA/CoreMark score. They offer up to 560 KB of Flash, 64 KB SRAM and 102 GPIOs for the S6E1B series. With their fast wake-up from standby modes, the MCUs optimise power savings by remaining in low-power states for longer durations before quickly switching back to active modes.
Peripheral integration includes communication interfaces with AES hardware encryption, a rich set of digital and analog peripherals and a high-accuracy internal CR oscillator. The chips are available in small QFN and QFP packages, or even smaller 6,4 mm² wafer-level chip scale package (WLCSP).
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version