27 January 2016
Manufacturing / Production Technology, Hardware & Services
Henkel Adhesive Technologies’ Gap Filler 1400SL combines the properties of low viscosity and, relative to conventional self-levelling products, comparatively high thermal conductivity in a unique formula designed to accommodate challenging architectures.
It has a thermal conductivity of 1,4 W/m-K and is exceptionally soft when cured, allowing for absorption of coefficient of thermal expansion (CTE) stresses and providing mechanical shock dampening for fragile assemblies. The material is ideal for multiple applications including high-power components such as FETs, industrial controllers with transient loads and automotive electronics like DC-DC converters for hybrid vehicles.
Cured at room temperature with no by-products, Gap Filler 1400SL provides consistent curing throughout the compound with no restrictions on thickness and the ability to accelerate curing with exposure to elevated temperature.
FineX: Makes shielding clear Avnet Abacus
Manufacturing / Production Technology, Hardware & Services
Panasonic Industry launches high-transparency, low-resistance, flexible transparent conductive film for electromagnetic wave shield with pre-applied OCA.
Read more...Collaboration is now critical RS South Africa
Manufacturing / Production Technology, Hardware & Services
The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
Read more...Disruption is the new normal. Effortless is the new competitive advantage. Seven Labs Technology
Manufacturing / Production Technology, Hardware & Services
Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.
Read more...World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
Manufacturing / Production Technology, Hardware & Services
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
Read more...Inline vapour phase soldering for high-volume production MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
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