Electronics Technology


Smallest embedded V.90 modem

21 November 2001 Electronics Technology

For products requiring Internet connectivity, Texas Instruments has introduced what it claims is the lowest power and smallest V.90 embedded modem chipset for integration into end-equipment with very small form factor. The two-chip solution cuts power consumption by as much as 90% and board space by up to 40% over existing solutions, enabling a new class of Internet access devices with smaller power and space requirements.

The two-chip solution, which consists of a power-efficient TMS320C54V90 DSP and PCTEL line-powered Data Access Arrangement (DAA), consumes only 25 mW of power when running a V.90 modem and requires only 9,68 cm2 of board space. The C54V90 DSP incorporates PCTEL's modem control and data pump software, eliminating the need for off-chip memory, and integrates the digital portion of the DAA on-chip. This decreases the conventional embedded modem solution from five or six chips to just two chips.

TI and PCTEL also plan to release a V.92 embedded modem chipset that will offer more symmetric data transmission speeds, faster handshaking time, and a 'modem on hold' feature to take another phone call on the same line.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

General-purpose MCU with RISC-V architecture
EBV Electrolink DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.

Read more...
AI-native IoT platform launched
EBV Electrolink AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.

Read more...
Serial SRAM up to 4 MB
EBV Electrolink DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.

Read more...
Microchip expands its mSiC solutions
EBV Electrolink Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.

Read more...
Powering up the intelligent edge
EBV Electrolink DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Read more...
Flash for AI
EBV Electrolink AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.

Read more...
UFS Ver. 4.0 embedded Flash memory devices
EBV Electrolink Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.

Read more...
InnoSwitch5 Offline Flyback Switcher IC
EBV Electrolink Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.

Read more...
IGBT power module
EBV Electrolink Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.

Read more...
Making Matter provisioning secure and easy
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
Integrated solution of CommScope’s PKIWorks platform with STMicroelectronics’ STM32WB wireless microcontroller enables IoT security for Matter device development.

Read more...