Electronics Technology


Smallest embedded V.90 modem

21 November 2001 Electronics Technology

For products requiring Internet connectivity, Texas Instruments has introduced what it claims is the lowest power and smallest V.90 embedded modem chipset for integration into end-equipment with very small form factor. The two-chip solution cuts power consumption by as much as 90% and board space by up to 40% over existing solutions, enabling a new class of Internet access devices with smaller power and space requirements.

The two-chip solution, which consists of a power-efficient TMS320C54V90 DSP and PCTEL line-powered Data Access Arrangement (DAA), consumes only 25 mW of power when running a V.90 modem and requires only 9,68 cm2 of board space. The C54V90 DSP incorporates PCTEL's modem control and data pump software, eliminating the need for off-chip memory, and integrates the digital portion of the DAA on-chip. This decreases the conventional embedded modem solution from five or six chips to just two chips.

TI and PCTEL also plan to release a V.92 embedded modem chipset that will offer more symmetric data transmission speeds, faster handshaking time, and a 'modem on hold' feature to take another phone call on the same line.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Advanced pressure monitoring sensor
EBV Electrolink Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.

Read more...
High-efficiency 600 V power MOSFET
EBV Electrolink Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.

Read more...
High-performance FPGA family
EBV Electrolink DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.

Read more...
KIOXIA pioneer new 3D Flash technology
EBV Electrolink DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.

Read more...
Automotive Ethernet communications
EBV Electrolink News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.

Read more...
KIOXIA sampling UFS 4.1 embedded Flash
EBV Electrolink DSP, Micros & Memory
The new UFS devices use KIOXIA’s 8th-Gen BiCS FLASH 3D to boost speed and power efficiency.

Read more...
Versatile range of camera modules
EBV Electrolink Opto-Electronics
The CAM-66GY pro-modules from ST are a full range of sample camera modules made for a seamless evaluation and integration of the VD66GY 1,5-megapixel colour image sensor.

Read more...
Elevate your motor control designs
EBV Electrolink DSP, Micros & Memory
Built on an Arm Cortex-M33 core running up to 180 MHz, the MCX A34 family combines high-performance math acceleration and advanced motor control subsystems to unlock efficient motor drive solutions.

Read more...
MCU for noisy environments
EBV Electrolink DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved