Electronics assembly quality benchmarks

5 October 2016 News

IPC’s ‘Study of Quality Benchmarks for Electronics Assembly 2016’ is now available, providing valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

The quality control measurements covered by the study include first-pass yields for various test methods in use, as well as the percentage of products subjected to these tests. Yields and defect rates at final inspection, internal yields of key processes, and DPMO and yield targets are also covered.

Average cost of poor quality as a percentage of sales for rework, scrap and labour time for touch-up after wave soldering are reported. The study also reports on the use of various quality control methods. Customer satisfaction and supplier performance metrics are covered, as well as the industry’s adoption of major quality certifications.

The data – in averages, medians and percentiles – are segmented by company size tier, by region, and by type of production, including rigid PCBs, flexible circuits, end products, mechanical assembly, cable and harness, discrete wiring terminal and connectors, and rigid backplanes. The aggregate data represent 94 electronics assembly companies of all sizes from North America, Europe and Asia.

For more information visit www.ipc.org/AssemblyBenchmark2016

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