9 November 2016
Manufacturing / Production Technology, Hardware & Services
Indium was presented with the Global Technology Award for Solder Paste for its Indium10.1HF solder paste at this year’s SMTA International (SMTAI) Conference in Illinois, USA.
Indium10.1HF is a halogen-free, no-clean formula that delivers ultra-low voiding in bottom terminated components (BTCs). The flux is specifically engineered to improve reliability by minimising voiding while also providing excellent wetting, lower solder beading, and reduced solder balling to meet IPC specifications. Indium10.1HF also minimises slumping and resists head-in-pillow defects.
The solder paste is well-suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. It has robust reflow capability and a wide process window, accommodating various board sizes, component sizes and throughput requirements.
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printer friendly version