Henkel’s GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components. The soft and compliant gap filling material has a thermal conductivity of 5,0 W/m-K and delivers outstanding thermal performance with very low compression stress. The low modulus and unique filler package is ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance.
GAP PAD HC 5.0 allows for superb interfacing and wet-out, even to rough surfaces and topographies, which ensures uniform material coverage across the component and heatsink for maximum performance. Compared to previous-generation materials, it offers better handling, an enhanced dielectric constant, improved volume resistivity and better thermal impedance performance.
Manufactured with a natural tack on both sides, GAP PAD HC 5.0 contains no thermally-impeding adhesive layers and is available in a range of thickness from 0,508 mm up to 3,175 mm.
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