Computer/Embedded Technology


New Raspberry Pi 3 compute modules available from RS

22 February 2017 Computer/Embedded Technology

RS Components announced the latest version of the Raspberry Pi Compute Module, based on the Raspberry Pi 3 architecture. Designed for professional engineers to develop embedded systems, the new Raspberry Pi 3 Compute Module (CM3) fits into a standard DDR2 SODIMM socket and provides the same basic processing capabilities as the Raspberry Pi 3.

In common with the Raspberry Pi 3, CM3 incorporates a 64-bit Broadcom BCM2837 application processor, built around an ARM Cortex-A53 quad-core processor running at up to 1,2 GHz, and 1 GB of LPDDR2 RAM. It provides 4 GB of onboard eMMC Flash storage, and retains an identical pin-out to the original Compute Module (CM1).

In addition, RS is stocking the new low-cost Raspberry Pi 3 Compute Module Lite (CM3L). This includes the BCM2837 application processor and 1 GB RAM, but has no onboard Flash storage. Developers can provide an eMMC device or SD card socket on their application-specific base board.

Like its predecessor, the Raspberry Pi 3 Compute Module is designed for integration into industrial-type applications. One example is the range of next-generation large-format displays from NEC. These integrate a socket for an optional Raspberry Pi 3 Compute Module, and are designed for use in brightly lit public spaces such as schools, offices, shops and railway stations.

The Raspberry Pi 3 Compute Module can also be purchased from RS as part of a development kit, bundled together with the Compute Module IO Board. This simple, open-source development board brings out all of the I/O connectivity of CM1, CM3 or CM3L to pin headers and flexi connectors, and allows the developer to program onboard eMMC Flash over USB. It serves as a prototyping platform, and as a starting point for the development of application-specific base boards.

For more information contact RS Components, +27 (0)11 691 9300, [email protected], www.rsonline.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

High-performance IMU
RS South Africa Analogue, Mixed Signal, LSI
TDK Corporation has announced availability of the new InvenSense SmartMotion ICM-536xx family of high-performance 6-axis IMUs.

Read more...
Rugged, I/O-rich NVIDIA Jetson solutions
Electronic Products Design Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.

Read more...
Wide frequency range inductors
RS South Africa Passive Components
TDK Corporation has expanded its ADL4524VL series (4,5 x 2,4 x 2,6 mm – L x W x H) of wire-wound inductors for automotive power-over-coax.

Read more...
High-temperature closed-loop MEMS accelerometer
RS South Africa Analogue, Mixed Signal, LSI
This sensor from TDK is a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling applications.

Read more...
New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.

Read more...
Smallest 13th gen Intel SBC
Vepac Electronics Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.

Read more...
Versatile PoE extender
Vepac Electronics Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.

Read more...
Automotive power-over-coax inductor
RS South Africa Power Electronics / Power Management
TDK has launched the ADL8030VA, a high-performance inductor designed specifically for power-over-coaxial applications.

Read more...
3-terminal filters for automotive applications
RS South Africa Power Electronics / Power Management
TDK has expanded its YFF series of 3-terminal filters for automotive applications to include higher voltages up to 35 V and higher capacitances up to 4,7 µF.

Read more...
First NVMe SSD Built with 8th-gen BiCS FLASH
EBV Electrolink Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved