22 March 2017Manufacturing / Production Technology, Hardware & Services
VIGON PE 190A is Zestron’s latest defluxing agent for power electronics and printed circuit boards. It was specifically developed for cleaning power electronics in spray-in-air processes. Due to its alkaline formulation, it provides excellent performance when it comes to deoxidising copper substrates. Even heavy stains and dark rims around chips can be removed completely, leaving the copper surface in an optimal state for subsequent processes such as wire bonding or moulding.
At the same time, VIGON PE 190A has excellent compatibility with materials commonly used in power electronics, such as copper, nickel and aluminium. The cleaning agent is further recommended for PCB defluxing, specifically focusing on cleanliness under low-standoff components. It is a water based MPC cleaning agent, has no flash point and can be applied in all common spray-in-air equipment.
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printer friendly version