19 July 2017Manufacturing / Production Technology, Hardware & Services
Goepel Electronic has released the latest version of the X Line • 3D inline X-ray system for high-performance 3D inspection in large-scale production. Improvements in hardware and new software functions ensure even higher test speeds and thus shorter cycle times.
The X Line • 3D Series 300 offers improved PCB transfer, significantly reducing PCB assembly handling time. In addition, systems of the speed variant X40PLUS are now capable of scanning speed of up to 510 mm/s during image acquisition. A new soft-stop option can be used to stop circuit boards and ceramic substrates in seconds, using a new sensor that captures the assembly front edge without contact from above. The unit under test comes to a standstill in a very short time, without the risk of damage as with mechanical ‘hard stops’.
On the software side, the new version of Pilot AXI 3.3 is available for the X Line • 3D. Advanced test functions capture air inclusions (voids) and solder balls even more reliably, while new filter options provide additional image optimisation. In addition, the necessary test program generation time for the system software Pilot AXI has been shortened.
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