19 July 2017Manufacturing / Production Technology, Hardware & Services
Asscon recently presented a new vacuum soldering system based on state-of-the-art, patented soldering technologies and offers top soldering quality. The multi-vacuum in-line soldering system features dual lane transport and operates without workpiece carriers for vapour-phase vacuum soldering. The system is ideally suited for the void-free large-scale production of highly complex assemblies, including 3D-MID in continuous operation (24/7) with void rates below 1%, as well as for small series manufacturing with the highest quality requirements.
Compared with the single-lane version, the dual-lane transport facility provides 65% higher throughput, while power consumption of 25 kW/h is two to three times lower than traditional convection soldering machines. The machine processes assemblies with dimensions (L x W) up to 620 x 450 mm with single-lane transport, and up to 620 x 260 mm with dual lane transport.
Further advantages include symmetrical and asymmetrical conveyors, additional cooling, especially for solid products, and no downtimes when changing over products. What is more, the pin and chain conveyor system ensures high throughput. Since the vacuum can be deactivated on demand, the system can also be used as a standard in-line vapour-phase system.
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