These capacitors offer the reliability afforded by ceramic multilayer fabrication using advanced ceramic and electrode formulations, with thin, dense and precise dielectric layers to satisfy unique and difficult requirements. Energy density exceeds that of conventional Class 1 materials and offers excellent short duration pulse delivery at temperatures to 200°C.
These high temperature, high energy capacitors are manufactured with a dielectric formulation designed for reliable operation under single or repetitive high energy, multiple pulse firing into typical EFI and LEEFI circuits where resistive loads are in the 0,10 to 0,25 Ω range. Discharge pulse width, which is typically less than 100 nanoseconds, will vary with load conditions which are influenced by inductive and resistive load components.
With exceptionally low ESR and low signal distortion, additional applications at high temperature include power supply filtering, energy storage and coupling/decoupling. All parts are 100% pulse screen tested and are evaluated at temperature extremes up to 200°C consistent with munitions and oil field exploration/seismic detonation conditions. As an added safety feature, these pulse energy capacitors can be supplied with integral bleed resistors at various resistance values.
Offered in chip sizes 1825 to 7565, other sizes, voltages and capacitance ratings are available in single, series and series/parallel arrangements for custom applications and provide exceptional discharge energy at elevated voltages. A 500 MΩ safety bleed resistor is standard but other values are available. Novacap’s design engineers are on hand to help design the proper solution to meet specific requirements.
PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Nordic expands nRF91 series RF Design
DSP, Micros & Memory
Nordic Semiconductor has announced the expansion of its nRF91 series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
Read more...LEXI-R10 series cellular module RF Design
Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.
Read more...LTE-M modules with integrated GNSS RF Design
Telecoms, Datacoms, Wireless, IoT
u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity. The SARA-R52 and LEXI-R52 series optimise cost and performance, while eliminating the need for extra components.
Read more...Marki Microwave introduces Prodigy RF Design
Telecoms, Datacoms, Wireless, IoT
Marki Microwave has introduced a new automated filter design tool called Prodigy, which brings MMIC filter design capability directly to the user.
Read more...Nordic tech tour RF Design
News
Join the Nordic Tech Tour EMEA, and stay ahead in a rapidly evolving IoT landscape.
printer friendly version