1 January 2018
Manufacturing / Production Technology, Hardware & Services
Essemtec’s Puma is a high-speed pick-and-place solution that can also be used in the ultra-flexible prototyping development sector. With an IPC assembly performance of 18 100 components per hour, the machine pushes forward into the mid-range field.
To further increase flexibility it boasts up to 280 feeder positions; this means Puma offers the highest number of feeders in relation to the machine’s footprint. It processes PCB sizes up to 1800 mm x 610 mm.
Aside from handling the assembly processes, Puma also dispenses and jets in parallel up to 150 000 dots per hour. When all three axes are used exclusively for dispensing fluids, the platform is called Tarantula. There are five valve technologies to choose from and with the plug-and-play method all heads can be retrofitted or changed over on site.
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Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
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BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
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By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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Read more...Global electronics solutions since 1964 IMP Electronics Solutions
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Read more...When do you need Nitrogen in reflow? Truth Electronic Manufacturing
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