1 January 2018
Manufacturing / Production Technology, Hardware & Services
KOKI announced a newly developed, general application solder paste with highly balanced SMT performance, in the form of S3X58-G801.
In today’s manufacturing environment, a totally balanced, high-performance solder paste with features like high wetting, ultra-low solder balling and low voiding, is required. At the same time, more emphasis is placed on achieving a stable printing process, so a stable viscosity is vital.
S3X58-G801 is engineered with a highly heat-resistant flux that stays inactive at ambient temperature, thereby ensuring stable viscosity of the solder paste on the shelf and during continuous printing. This heat resistance effectively prevents heat-slump and eliminates the occurrence of solder balls. Furthermore, the solder paste achieves low voiding thanks to the newly engineered and improved fluidity of the flux which reduces the generation of gas during the reduction reaction.
S3X58-G801 is a process-friendly, drop-in replacement solder paste that reduces the hassle of changing the material and ensures high-quality solder joints.
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version