1 January 2018
Manufacturing / Production Technology, Hardware & Services
Kester 959T is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface-mount circuit board assemblies. It was developed to minimise the formation of micro-solderballs during wave soldering operations. The flux contains a small percentage of rosin (0,5%), which improves solderability, heat stability and surface insulation resistance.
959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry, and leaves evenly distributed residues for the best cosmetic appearance. It leaves no streaky, white residues and is classified as ORL0 per J-STD-004.
This flux can be applied to circuit boards by a spray, foam or dip process. Flux deposition should be 120-240 g of solids/cm². An air knife after the flux tank is recommended in a foam and wave application to remove excess flux from the circuit board and prevent dripping on the preheated surface.
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