1 January 2018
Manufacturing / Production Technology, Hardware & Services
Heraeus Electronics is expanding its range of no-clean soldering pastes with a low melting point. The new F498 product series allows significant cost savings in the soldering process.
The new series of soldering pastes is characterised by a low void rate and outstanding wetting properties on a wide range of different surfaces. This reduces the formation of solder balls (mid-chip balling). The lower temperature in the reflow process reduces energy consumption, and longer cleaning intervals due to the lower temperatures reduce maintenance costs.
Soldering pastes with a low melting point from Heraeus Electronics allow the soldering temperature of a lead-free process to be reduced by around 70°C to 80°C. Components and circuit boards are subjected to less temperature stress, allowing lower-cost components to be used. In addition, these soldering pastes can be used to mount components with lower temperature specifications such as those from optoelectronics or the LED industry.
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