Nordic Semiconductor announced that its Nordic Thingy:52 IoT Sensor Kit was named winner of the highly competitive development kit category by the judges of the 2017 Annual Creativity in Electronics (ACE) Awards. The ACE Awards - held in Silicon Valley in conjunction with Embedded Systems Conference - are a renowned awards programme which showcases the industry’s most innovative electronics products.
Nordic Thingy:52 is a development tool targeted at IoT wireless sensor projects and based on Nordic’s nRF52832 Bluetooth Low Energy (Bluetooth LE) system-on-chip (SoC) and S132 SoftDevice RF software protocol. The sensor kit enables an app developer with no firmware coding expertise or high-level development tools to quickly design and demonstrate Internet of Things (IoT) devices, and associated mobile device and Internet apps.
The functionality of the Thingy can be configured over-the-air via a Bluetooth API. That makes it possible to create demos and prototypes without actually programming the board itself. The Thingy is built around the nRF52832 Bluetooth 5 SoC. It connects to Bluetooth-enabled mobile phones, laptops, tablets and similar devices, and sends data to/from its sensors and actuators to an app and to the cloud. It comes with the accompanying Nordic Thingy:52 app for iOS, Android and a web app.
Nordic Thingy:52 was shortlisted in the development kit category alongside three other major semiconductor vendors from the USA and Japan, but was adjudged by a panel of 15 industry experts as the winner against criteria including timeliness and suitability for target market, breakthrough technology and community interest.
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...Multi-band GNSS patch antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas AHP2356A is a compact, high-performance active GNSS patch antenna designed for next-generation positioning systems requiring precision, reliability, and multi-constellation support.
Read more...Wideband MMIC power amp RF Design
Telecoms, Datacoms, Wireless, IoT
The Qorvo QPA2597 is a wideband MMIC power amplifier built using proven GaN on SiC technology and designed to operate across the 2 to 6 GHz frequency range.
Read more...AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...Siemens acquires Canopus AI ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.