Computer/Embedded Technology


EBGA-packaged CPU half-size board

13 February 2002 Computer/Embedded Technology

NEXCOM has announced the world's first half-size board powered by a VIA C3 EBGA packaged CPU (Pentium III/Celeron class) onboard. Responding to the recent developments in the CPU market, NEXCOM ruled out the Socket 7 provision on its half-size boards. This comes in view of the current announcements that Socket 7 supported CPUs will soon be obsolete, according to the company.

The PEAK 603, aside from standard embedded board design, signifies a rejuvenated version of the PEAK 555. It abandons the use of Socket 7 microprocessors (ie Pentium MMX) in preference for the new VIA C3 chip. Supporting C3 chips ranging from 400 to 667 MHz (CPU is scaleable, 800 MHz expected soon), the PEAK 603 is an EBGA-packaged engine board that unlocks new power in the field of embedded applications.

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