STMicroelectronics’ new ACEPACK (Adaptable Compact Easier PACKage) modules provide cost-effective and highly integrated power conversion for 3-30 kW applications including industrial motor drives, air conditioners, solar generators, welders, battery chargers, UPS controllers and electric vehicles.
The space-efficient, low-profile ACEPACK technology combines high power density with reliability in an economical plastic package. Features include optional solder-free press-fit connections, which simplify assembly as an alternative to conventional soldered pins, and metal screw clamps that enable fast and reliable mounting.
Inside, ST’s third-generation field-stop trench IGBTs deliver a combination of low on-resistance and high switching performance. Two configurations are available, giving a choice of sixpack modules that contain six IGBTs with freewheel diodes as a three-phase inverter, or power integrated modules (PIM) that provide a complete driver power stage. The PIMs are converter-inverter-brake (CIB) devices that integrate a three-phase rectifier, a three-phase inverter, and a braking chopper for handling energy returned from the load. Both types also contain an NTC thermistor for temperature sensing and control.
Various PIM/CIB and sixpack devices are available in ACEPACK 1 or larger ACEPACK 2 sizes, featuring either 650 V or 1200 V IGBTs and current ratings from 15 A to 75 A. The internal layout of the modules is optimised for low stray inductance and low EMI emissions, which simplifies meeting EMC regulations, and 2,5 kV isolation ensures robust performance under harsh operating conditions. All modules are specified up to 175°C maximum operating temperature, giving designers extra freedom to optimise heatsink size and power dissipation.
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