Computer/Embedded Technology


CompactPCI backplane suited for computer telephony

13 February 2002 Computer/Embedded Technology

The 173521 Erni backplane with eight slots and implementation of the CT-bus H.110 - ECTF is used in CompactPCI computer systems. Its features make it ideally suited for telecom and datacom.

* Form factor 6U dimensions: HxL: 262,05 mm-0,3 x 203,2-0,3 mm.

* Eight slots, seven peripheral slots.

* Fully shielded 10-layer PCB for best EMC characteristics.

* Decoupling of supply voltages.

* V(I/O) selectable - 3,3 or 5 V.

* Controlled impedance of 65 W-stripline technology.

* PICMG 2.0 R3.0 and PICMG 2.1 R1.0 hot-swap features.

* Clock frequency 33 MHz.

* Full 64 bit implementation.

* Rear I/O via P3, P4 and P5 possible at each slot.

* IEC 61076-4-101 and PICMG 2.0 R3.0 connectors - A and AB shrouds with guides for safe mating.

* Two connectors for fans - 12 V supply.

* Two connectors for drives 5, 12 V supply.

* Various power supply options: 20-pin ATX. Connector; Faston or M4-screw connector; PICMG 2.11 R1.0 DIN style connector.

* 7 H.110 ECTF and PICMG 2.5 R1.0 specification slots.

* Secure separation between hazardous voltages and SELV circuit IEC 950 and ECTF H.110.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Clearing the Static: Understanding the significance of ESD audits
Actum Electronics Circuit & System Protection
An ESD (Electrostatic Discharge) audit is the first step in establishing an ESD plan, and it is important to include all areas where ESD-sensitive components are being handled.

Read more...
Microsoft Windows IoT on ARM
Altron Arrow Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.

Read more...
Hardened-grade network switches
CST Electronics Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).

Read more...
Switched mezzanine card for enhanced Ethernet connectivity
Rugged Interconnect Technologies Computer/Embedded Technology
The TXMC897 sets a new standard in high-speed Ethernet communication, with advanced features and flexibility.

Read more...
Ryzen V3000 computer on module
Altron Arrow Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.

Read more...
1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.

Read more...
Maximising edge computing
Computer/Embedded Technology
Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.

Read more...
Duxbury unveils next-gen solar-powered switches
Computer/Embedded Technology
These powerful solar-powered switches are ideal for any environment requiring reliable Power-over-Ethernet (PoE) capabilities.

Read more...
Clearing the Static: The importance of ESD wrist straps
Actum Electronics Circuit & System Protection
ESD clothing plays a pivotal role in preventing that people do not charge the products that they are working with.

Read more...
UFS Ver. 4.0 embedded Flash memory devices
EBV Electrolink Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.

Read more...