VIA launches JEDEC validation programme
13 February 2002
News
VIA Technologies has announced the industry's first independent JEDEC standard validation programme for DDR333 memory products in conjunction with Advanced Validation Labs (AVL).
The JEDEC Solid State Technology Association (previously known as the Joint Electron Device Engineering Council) is the semiconductor engineering standardisation body of the Electronic Industries Alliance. It has been the foremost standards development organisation for the semiconductor industry since 1958.
The VIA-certified validation testing programme involves the testing of memory modules using VIA's reference platform and bespoke software. The validation test process, co-developed by AVL and VIA, includes thermal testing to further stress memory modules under test.
"VIA has successfully used JEDEC standard validation programs to secure the transition of PC133 SDRAM and DDR266 SDRAM memory technologies into the mainstream market" says Tim Handley, VIA's Marketing Manager in South Africa.
"Our collaboration with AVL allows us to speed time-to-market and sustain the confidence of our customers through a technology transition by ensuring the reliability and compatibility of DDR333 devices and modules with VIA platforms."
For further information contact Tim Handley, VIA Technologies, [email protected]
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version