1 January 2019
Manufacturing / Production Technology, Hardware & Services
Yamaha Motor’s YSM20W, a member of the Z:LEX series, provides flexibility and efficiency in various forms of production without the need for replacing the head thanks to the ‘1 head solution’ concept. This model is a wide-body version of the Z:LEX YSM20 universal modular, and is capable of handling extra-large PCBs for automotive, industrial, medical, power devices, and LED lighting etc. with its significantly increased adaptability to PCB sizes and weight.
Ideal for high-mix applications, the YSM20’s versatility comes thanks to the HM high-speed multi-purpose head using 10 nozzles in-line, supporting from ultra-tiny chips of 03015 (mm) to large components of 45 x 100 mm and height of 15 mm. The FM flexible multi-purpose head with five nozzles in-line supports force control and handles a broad spectrum of components from ultra-tiny chips of 03015 (mm) to ultra-large components of 55 x 100 mm and tall components with heights up to 28 mm.
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Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
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The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
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There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
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The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
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With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
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Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
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To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
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