1 January 2019
Manufacturing / Production Technology, Hardware & Services
Yamaha Motor’s YSi-SP is a high-speed 3D solder paste inspection machine that enables high-speed, high-accuracy inspections based on the company’s ‘1-head solution’ concept for using a single type of head to handle various inspections.
The YSi-SP is Yamaha Motor’s first solder paste inspection (SPI) machine, and employs a proprietary algorithm combining 2D- and 3D-based measurements, and image resolution switch-over utilising super-high resolution technology.
Tapping into the company’s expertise as a comprehensive manufacturer of a full lineup of surface mounting machinery, the YSi-SP can swiftly coordinate with other Yamaha machines, such as performing automatic setup changes, automatically adjusting solder misalignment, and automatically converting adhesive inspection data from the dispenser.
While offering Statistical Process Control (SPC) to perform a wide range of statistical processing, the YSi-SP can also be equipped with various optional features, including bonding inspection and foreign matter inspection.
Soldering day highlights
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JAPAN UNIX has published a new event report and highlight video from their UNIX SOLDERING DAY 2026 in Hungary. This event reflects on their commitment to supporting manufacturers not only through soldering automation systems, but also through technical education, live demonstrations, hands-on training, and practical engineering know-how.
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Read more...Engineering trust in South Africa’s SMT sector ZETECH ONE
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The AutoBee-D1 desktop automated programmer is designed to simplify the programming of devices, while delivering consistent accuracy, high throughput and reduced manual intervention.
Read more...Zero PFAS die attach paste Testerion
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With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero per- and polyfluoroalkyl substance (PFAS) alternate silver filler die attach paste.
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Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.
Read more...Polypropylene pole-top boxes support smarter, more secure electricity networks
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Read more...200 W of power in a space-saving design Vepac Electronics
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The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.
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