1 January 2019
Manufacturing / Production Technology, Hardware & Services
Electrical reliability is a must-have for electronic components and products to work properly, especially when issues like ionic contamination under low stand-off components can cause dendritic growth which can lead to intermittent operation or short circuiting, and ultimately field failures.
Indium8.9HF is an air-reflow, no-clean solder paste specially formulated to enhance electrical reliability and eliminate dendritic growth in high-power products, such as automotive electronics manufacturing.
Indium8.9HF delivers peace of mind, knowing that assemblies will maintain integrity with increased electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth; and improved thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure.
Indium8.9HF can accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favoured by the electronics industry to replace conventional Pb-bearing solders.
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