The new W71NW20KK1KW from Winbond, which combines robust single level cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory, provides sufficient memory capacity for 5G cellular modems that are intended for use as customer premises equipment (CPE) in homes and offices.
While mobile 5G modems typically require larger memory densities, static 5G CPE modems can operate effectively with memory capacities of 2 Gb NAND or DRAM. By offering this memory combination in a compact single package, the W71NW20KK1KW enables 5G modem manufacturers to meet the system requirements of CPE units at low materials and production costs.
The chip is a 149-ball ball grid array (BGA) package consisting of a 2 Gb SLC NAND Flash die and a 2 Gb LPDDR4x DRAM die. The robust SLC NAND Flash offers enhanced endurance specifications and high data integrity. It only requires 4-bit ECC to achieve high data integrity, but the device’s 2 KB + 128 B page size provides enough space for the use of 8-bit ECC.
The W71NW20KK1KW has an 8-bit bus, and is organised in blocks of 64 pages. The NAND die’s performance specifications include a maximum page read time of 25 µs and a typical page program time of 250 µs.
The LPDDR4x DRAM die, which operates at a high frequency of 1866 MHz, provides an LVSTL_11 interface and features eight internal banks for concurrent operation. It offers a data rate of up to 4267 MT/s, supporting the fast data transfer rates to be offered by 5G cellular networks.
Microchip enhances TrustMANAGER platform Altron Arrow
DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.
Read more...MCU for low-power, IoT applications NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...EEPROMs for industrial and military markets Vepac Electronics
DSP, Micros & Memory
Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.
Read more...PLCnext – Open, IIoT-ready industrial platform IOT Electronics
DSP, Micros & Memory
PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.
Read more...ICs vs modules: Understanding the technical trade-offs for IoT applications NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...Hardware quantum resistance to embedded controllers Avnet Silica
DSP, Micros & Memory
To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.
Read more...High-performance processor for edge-AI Altron Arrow
DSP, Micros & Memory
The STM32MP23 microprocessor from STMicroelectronics is the latest addition to the STM32MP2 series, designed to meet the demands of industrial, IoT, and edge AI applications.
Read more...Wi-Fi in 2025: When is Wi-Fi 7 the answer? iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.
printer friendly version