31 July 2019Manufacturing / Production Technology, Hardware & Services
The X Line 3D Series 400, an inline X-ray system from Goepel Electronic, has a new detector option for high-resolution 3D X-ray inspection of electronic assemblies. The MultiAngle Detector 3 combines the high image quality of the StingRay Detector introduced last year with the rapid inspection speed of a scanning image acquisition.
The 3D X-ray images are captured in motion. The system is particularly suitable for AXI inspection of multi-panel PCBs and complex assemblies with many concealed solder joints. This represents an advantage over conventional AXI systems with flat panel detector technology.
In addition to image quality and inspection speed, the resolution in the Z-direction has been increased significantly. Even thinner reconstructed layers (3D technology) allow complete separation of the top and bottom assembly sides, allowing complete fault detection. A clear separation is indispensable, especially for PCBs assembled on both sides.
Customers who only require single-sided assemblies to be inspected have a further advantage with the new detector. The number of angled projections for generating a 3D image is variable with the MultiAngle Detector 3. This means that single-sided PCBs can be inspected with fewer projections, which increases the inspection speed. In addition, the uniform component library can continue to be used with this procedure and the time for creating the test program can be significantly reduced.
The X Line 3D is delivered with the programming software Pilot AXI 3.4 as well as the machine software Pilot Inspect 3.4. This allows the system to automatically monitor itself and to create usage-based maintenance plans in advance. This predictive maintenance function reduces maintenance and machine downtimes and thus also costs.
For more information contact MyKay Tronics, +27 11 869 0049, mykay@iafrica.com
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