27 March 2002Manufacturing / Production Technology, Hardware & Services
Metcal launched the APR-5000 array package rework system at Productronica 2001. This is an advanced, versatile system offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages.
Capable of handling boards up to 203,2 x 254,0 mm with a placement accuracy to 0,0254 mm and interconnection pitches as low as 0,3 mm, the APR-5000 is suited for reworking smaller PCBs such as cellphones and laptop computers.
According to the manufacturer, the APR-5000 is the first of a new range of Metcal array rework systems that address the specific demands of very different market segments, moving away from the 'one machine fits all' approach adopted by many rework system manufacturers.
The APR-5000 array package rework system incorporates Metcal's exclusive integral vision system that makes accurate component placement easy to achieve, allowing operators to simultaneously view the topside of the PCB and a superimposed image of the underside of the component. With micrometer adjustment, images can be accurately aligned in the X, Y and Theta axes prior to placement. In addition, integrating the vision system with the APR-5000 array package rework system's software eliminates the need for multiple monitors, fully optimising bench space.
As with production reflow technology, the APR-5000 array package rework system uses low airflow forced convection heating with a reflow head that delivers temperature uniformity, ensuring safe and simultaneous reflow of the component being removed without disruption to adjacent parts. Closed-loop, computer-controlled parameters of time, temperature and airflow guarantee process repeatability and precision.
To guarantee greater temperature uniformity, the PCB itself is centralised relative to the pre-heater - a design feature unique to the APR-5000 array package rework system.
Ergonomically designed, the APR-5000 array package rework system uses a minimum of bench space 457,2 x 711,2 mm. Because the system requires no special wiring and uses self-contained pumps, it can be moved to another bench with no need for fitting or plumbing.
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