Osram Optosemiconductors' innovative SmartLED joins its successful family of TOPLED and Mini-TOPLED devices. According to the company, these high quality devices have unique features that are due to set new standards in product development and design and open up new applications.
With the extremely small dimensions of SmartLEDs (1,6 x 0,8 x 0,6 mm), display and keypad lighting can take up less space on the circuit card. They have high thermal stability thanks to low thermal resistance and the devices' 'smart' resin. Maximum shelf temperature is as high as 110°C. The small size, low thermal resisltance and enhanced thermal stability mean that SmartLEDs can be more tightly packed than the company's comparable ChipLED and for the same current rating.
Since SmartLED can take higher current, it is also brighter. Or, putting it in another way, one needs fewer SmartLEDs per unit area to produce the same overall brightness in backlighting.
SmartLED chips come on a metallic leadframe. This kind of packaging ensures good thermal conductivity and high reliability. For automated placement, they are packed on a tape, meeting all common surface-mount standards so they can be processed without any retooling.
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