Infineon Technologies' FingerTIP evaluation kit enables the integration of a miniature fingerprint sensor into a wide variety of end-products including PCs, notebook computers, handheld devices, set-top boxes, ATMs, point of sale terminals, ticketing kiosks, building access systems, or any other application that would benefit from replacing PIN- or password-based user identification with biometric-based verification.
Infineon's FingerTIP sensor chip is a small (18 x 21 x 1,5mm) IC embedding a 288 x 224 pixel contact sensor array that images the lines and ridges of a human fingerprint when a user touches the device. Each pixel has an 8-bit data depth, enabling evaluation of subtle gradations (256 shades of grey) of a fingertip and their translation into a set of indices - the key identifying features of an individual fingerprint. Imaging and data transfer of an impression takes only milliseconds. The chip also incorporates extensive electrostatic discharge (ESD) protection features.
The company's new FingerTIP evaluation kit 2 - USB, demonstrates a biometric system using the FingerTIP sensor and FingerTIP software development kit (SDK), connected via USB interface to a PC. The evaluation kit consists of a FingerTIP sensor mounted in a small format PC-SC compliant smartcard reader unit plus extensive development and demonstration software. The hardware platform allows for storage of the biometric fingerprint template on a secure smartcard (included), on the PC hard drive or even in a client server environment, and theFingerTIP evaluation kit 2 can be connected directly to the USB port of a PC.
Software libraries included with the FingerTIP evaluation kit 2 are the Infineon software developer's kit (SDK) which performs all biometric functions, and a SDK for USB and smartcard communication allowing the integration of Infineon's biometric fingerprint recognition engine into PC-based USB and smartcard applications.
Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...DC-link capacitors with ultra-low inductance Electrocomp
Passive Components
TDK Corporation recently released its new series of MKP DC high-frequency film capacitors, a high-performance DC link capacitor platform for next-generation SiC-based power electronics.
Read more...What happens when trust can no longer live only in software?
Computer/Embedded Technology Electronics Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions.
Read more...Non-contact linear position sensor Electrocomp
Test & Measurement
The Vishay 40 LHE Linear Position Sensor, designed for industrial motion control and automation, delivers robust, non-contact measurement performance using Hall effect technology.
Read more...Compact 1250 V choke solution Electrocomp
Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.
Read more...Precision in next-gen asset tracking Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX’s advanced antenna technologies have been engineered specifically for compact, high-performance tracking devices.
Read more...Miniaturised RFID Tags Electrocomp
Telecoms, Datacoms, Wireless, IoT
In the rapidly evolving landscape of Industry 4.0, where precision, resilience, and compact design are more than buzzwords, Neosid is revolutionising identification through its NeoTAG line of RFID transponders.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Robust series of vertical-mating battery connectors Electrocomp
Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version