Computer/Embedded Technology


High bandwidth FIFOs

16 Feb 2000 Computer/Embedded Technology

IDT's x72 FIFOs are claimed to be the highest bandwidth FIFOs in the industry. The 3,3 V x 72 SuperSync II FIFOs operate at 100 MHz and are available in versions ranging from 32 Kb to 4 Mb densities. The FIFOs provide double the system bandwidth of existing x36 FIFO solutions in a single, high performance fine-pitch BGA package. IDT developed the x72 FIFO memories to support high-speed terabit switches and routers used by Internet service providers and carrier-class network operators. The devices not only provide the wide data paths needed but also deliver the performance and advanced features needed to make them the ideal solution for high-speed communications applications. The FIFOs are also the first to include JTAG which allows board designers to debug and test them and other components on the board.

All members of the extended-bus (x72) family of SuperSync II FIFOs are pin-compatible with each other and have a common feature set and timing characteristics with existing narrow-bus (x9/x18) and mid-bus (x36) SuperSync II FIFOs. In addition, the x72 FIFOs provide a separate serial clock, a synchronous output enable feature and bus-matching capabilities.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.

Read more...
Smallest 13th gen Intel SBC
Vepac Electronics Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.

Read more...
Robust series of vertical-mating battery connectors
Electrocomp Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.

Read more...
Versatile PoE extender
Vepac Electronics Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.

Read more...
Low-profile tantalum chip capacitors
Electrocomp Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.

Read more...
Compact high-performance antennas
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol 2,4 GHz antennas ideal for use in SiP applications.

Read more...
First NVMe SSD Built with 8th-gen BiCS FLASH
EBV Electrolink Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.

Read more...
Track with precision
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.

Read more...
RGBIR sensor with I2C interface
Electrocomp Opto-Electronics
Available in a miniature opaque 2,67 x 2,45 mm package, Vishay’s VEML6046X00 includes high-sensitivity photodiodes, a low noise amplifier, and a 16-bit analogue to digital converter.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved