Contactless memory solutions
19 June 2002
DSP, Micros & Memory
STMicroelectronics, a leader in EEPROM products, including serial EEPROMs up to 1 Mb density and ASSP (application-specific standard products) collaborated in the definition of the new ISO standard for contactless memories communications, ISO 14443 Type B, ISO 15693 and ISO 18000.
ST offers a new broad range of contactless memory products with an RF interface, ideal solution for TAGs, RFID and contactless access cards used for a large variety of applications such as traceability, transport, access control, object identification, tracking for logistic, luggage tracking, industrial laundry, e-label and anti-counterfeiting. In order to answer to the different environmental conditions, ST offers its contactless memories in a wide range of packaging.
The company's contactless products can cover both short and long range requirements. Electronic consumable identifications, cartridges, magnetic tapes, external batteries need a short range chip reader. On the contrary, RF identification, RF tag and e-label, anti-counterfeiting and objects tracking need long range standalone readers.
For short range: ISO 14443-2 Type B standard compliance; 13,56 MHz carrier frequency, 847 KHz subcarrier and 106 Kbps data transfer rate; ASK data modulation for reader-to-card and BPSK coding for card-to-reader; internal tuning capacitor.
For long range (LRI512 features): 512 bits with block lock; ISO 15693 levels 2 and 3 full standard compliance; 64 bits unique ID; EAS (electrical article surveillance); 13,56 MHz carrier frequency data; ASK data modulation from reader-to-card and Manchester coding for card-to-reader; and internal tuning capacitor.
For further information contact Avnet Kopp, 011 444 2333, [email protected], www.avnet.co.za
Further reading:
Accelerate development of physical AI deployments
Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...
AI-ready edge MPU for HMIs
Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...
Universal NFC device
Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...
Compact low-power 32-bit platform
EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...
Low-power memory born for edge AI
iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies
DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
Read more...
printer friendly version