16-bit microcontroller aimed at sophisticated, but cost-critical applications
14 August 2002
DSP, Micros & Memory
Hitachi has released its first microcontroller to incorporate the company's 4th generation Flash technology. The H8/3069F is manufactured using a 0,18 mm process and is the company's most cost-effective 512 KB Flash microcontroller. The enhanced Flash offers faster programming, on-chip firmware for simplified handling and a user boot program area. The device is aimed at highly sophisticated, but cost-critical industrial and consumer applications such as metering and white goods.
The H8/3069F is the flagship of Hitachi's H8/306x series and features the largest on-chip memory capacity in the economical H8/300H 16-bit microcontroller family by combining 512 KB Flash with 16 KB SRAM on-chip. At 2,5 s for 128 KB, the Flash write speed is approximately three times faster than current Hitachi products.
The on-chip firmware simplifies handling and shortens development time by eliminating the need for a user-written control program and making software more reliable and future-proof. The firmware consists of protected routines, which can be called from within a user's application code for writing and erasing to the Flash.
The H8/3069F provides a small additional protected Flash area of 8 KB, enabling customers to create their own boot program, store monitor firmware or hide encryption software. Program code stored in this area can be executed after reset simply by selection via mode pins. The guaranteed number of Flash write/erase cycles has been improved.
The new device has a comprehensive peripheral set including three 16-bit timers, four 8-bit timers and a watchdog timer. It also boasts an eight-channel 10-bit analog/digital converter, a four-channel DMA controller, 79 I/O channels and a three-channel serial interface (USART) with a smartcard interface option.
The microcontroller is supported by an evaluation kit and the realtime emulators E63064B and Lauterbach Trace32-Fire. The H8/3069F is available in a 100-pin QFP or TQFP.
For more information: Avnet Kopp, 011 809 6100, [email protected], www.avnet.co.za
Further reading:
Accelerate development of physical AI deployments
Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...
AI-ready edge MPU for HMIs
Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...
Universal NFC device
Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...
Compact low-power 32-bit platform
EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...
Low-power memory born for edge AI
iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies
DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
Read more...
printer friendly version