There exists a gap between machined, high-priced RF sockets and lower-cost stamped and moulded test sockets. RF sockets are produced by many companies, including Aries Electronics - all providing high-priced, low quantity sockets for IC test and characterisation. However, the market is calling for a product to bridge the gap between RF and test sockets.
This is according to Aries Electronics, who says that, in view of this fact it has designed the Integra 27 socket, a hybrid that combines the best attributes of RF and test sockets. All moulded components of this socket are made of high temperature plastic to handle burn-in temperatures. The spring probe contacts provide extremely long life and have an electrical performance of 2-10 GHz.
This innovative concept allows enough flexibility to socket devices that can accommodate any device type up to 27 mm, including MLF, CSP, BGA, and LGA types up to 27 mm, making the new socket extremely versatile. The socket body can be used over and over for different package types by purchasing three replacement parts, or only one if the package type and outside size is the same. According to the company the Integra 27 socket is much less costly than an RF machined socket, no matter who the supplier is. In many cases it is comparable in price to test sockets with no set-up or tooling charges.
Flexibility is provided by the use of three standard IDI spring probes (dependent on customer requirements). Other nonstandard IDI spring probes are also available on request.
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