Infineon's 66Plus series smartcard controllers are based on the same CPU platform as the successful 66S family, but offers larger RAM, ROM and EEPROM sizes and higher performance. It uses existing 66S software and has improved hardware security and fast calculation of cryptographic algorithms, as well as a memory management and protection unit. The latter separates the operating system from the different applications and supports secure multi-applications and loading of software in the field. The faster calculation of the crypto-algorithms and the higher CPU performance driven by the phase-locked loop shortens the transaction time in all applications. Advanced 0,25/0,22 µm embedded nonvolatile memory technology reduces die sizes which also improves mechanical reliability and reduces cost of silicon ¤ offers 500 000 read/write cycles for the EEPROM and more than 10 years data retention.
Microthermal liquid flow sensors 29 July 2020, Electrocomp
, Analogue, Mixed Signal, LSI
The SLF3x liquid flow sensor series from Sensirion represents an advancement for microthermal liquid flow sensors. By combining Sensirion’s 20-year track record in low and lowest flow rate sensing with ...
Read more...Industrial enclosures in stainless steel 31 August 2020, Electrocomp
, Enclosures, Racks, Cabinets & Panel Products
The IP66 EJSS family from Hammond Electronics is available in 304 or 316 grade stainless steel, supplied as standard in a natural smooth brushed finish. Sealed to IP66, the EJSS is designed for use as ...
Read more...Multi-sensor IoT module 29 July 2020, Electrocomp
, Telecoms, Datacoms, Wireless, IoT
TDK announced worldwide availability of the InvenSense SmartBug, a compact, wireless multi-sensor solution designed for a plethora of commercial and consumer IoT applications. The out-of-the-box solution ...
Read more...Smallest automotive maXTouch controllers 29 July 2020, Altron Arrow, Avnet Silica
, DSP, Micros & Memory
To help enhance and ease today’s driving experience, automotive manufacturers are implementing additional touch displays beyond the centre infotainment display (CID). Supporting the application of these ...
Read more...New low-power MCU from Renesas 29 July 2020, Hi-Q Electronics
, DSP, Micros & Memory
The RE01-256k is the newest member of Renesas Electronics’ RE microcontroller (MCU) family, implemented on the unique silicon on thin buried oxide (SOTB) ultra-low power process from Renesas. It offers ...
Read more...DIN rail enclosures 30 June 2020, Electrocomp
, Enclosures, Racks, Cabinets & Panel Products
Hammond Manufacturing has announced its 1597DIN family of UL94-V0 flame-retardant plastic enclosures for mounting to standard IEC/EN 60715 35 mm DIN rails for applications such as industrial control equipment, ...
Read more...CeraCharge now available in a small packing unit 30 June 2020, Electrocomp
, Passive Components
TDK is presenting a new packing unit for CeraCharge, the world’s first SMD technology solid-state rechargeable battery, in the compact size EIA 1812 (4,4 x 3,0 x 1,1 mm). The packing unit (B73180A0101M199) ...
Read more...Robust temperature sensor for E-mobility 30 June 2020, Electrocomp
, Analogue, Mixed Signal, LSI
The new B58703M1103A* temperature sensor is specially developed for demanding E-mobility applications, which call for high long-term stability. The NTC sensor is designed for a temperature range of -40°C ...
Read more...New low-power MCU from Renesas 30 June 2020, Hi-Q Electronics
, DSP, Micros & Memory
The RE01-256k is the newest member of Renesas Electronics’ RE microcontroller (MCU) family, implemented on the unique silicon on thin buried oxide (SOTB) ultra-low power process from Renesas. It offers ...
Read more...MCUs for precision sensing and measurement 29 July 2020, RS Components (SA)
, DSP, Micros & Memory
A new series of single-chip devices from Renesas, the RX23E-A microcontrollers (MCUs), combine an analog front end (AFE) and an MCU core for use in equipment that delivers high-precision measurements ...
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