Altera has announced that its system-on-a-programmable chip (SOPC) solutions are being used to deliver flexible, low-cost functionality to NEC's industry-leading 3G mobile core network products. NEC chose Altera over other programmable logic vendors for several reasons, says the company. These include device performance and price, a comprehensive intellectual property (IP) portfolio, and the need for the highest design flexibility. NEC's mobile core networking is enabling the creation of the first 3G communications networks in Japan, allowing consumers 'on the go' to access all their favorite forms of digital media including music, photos, voice, video, Internet, and visual phones.
"Programmable logic is an important part of our system architecture," noted Masakazu Kawakami, assistant general manager of the IP network division at NEC. "Altera's programmable logic devices, along with their IP selection, offer many of the benefits that we need to be successful."
NEC's 3G products include the wideband-code division multiple access (W-CDMA) mobile switching center (MSC) and W-CDMA radio network controller (RNC). When developing these products, NEC engineers required the high degree of design freedom that the Altera programmable logic devices (PLDs) provide. Altera PLD flexibility allowed NEC to quickly adapt to changes in the latest communication protocols and adjust their designs to meet the realtime needs of their customers, speeding their products to market.
"When industry leaders like NEC choose Altera solutions, it validates the strength of our product offering to 3G infrastructure developers," said Arun Iyengar, director of the wireless business unit at Altera. "The benefits provided by Altera SOPC solutions are invaluable in rapidly evolving areas like 3G communications where standards are still changing and the next generation of services is a moving target."
First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
printer friendly version