'Solderball pin' technology provides automation-friendly, high-coplanarity SMT methodology for interconnection parallel stacked PCBs

9 October 2002 Manufacturing / Production Technology, Hardware & Services

Autosplice has introduced a new SMT interconnect technology, known as Solderball Pin, which it claims brings together the advantages of automation and the flexibility of individually placed pins, along with solderball array technologies. The result is a robust SMT interconnect technique that can be discretely placed for maximum design flexibility and manufacturing efficiency while also automatically adjusting for coplanarity variances as high as 0,38 mm to 0,51 mm.

Solderball Pins provide an improvement over conventional through-hole pins that have typically been used for board-to-board interconnects. Designed with a high conductivity copper peg on one end and a solderball on the other, they are inserted into the daughtercard PCB, which is then placed on to the motherboard PCB and reflow-soldered using existing processes. A tapered peg design assures easy insertion and consistent seating and the solderball automatically compensates for coplanarity variances as solderjoints are formed during final reflow to the motherboard PCB. An integrated insulator collar on the Solderball Pin prevents unwanted wicking of solder up the length of the pin itself while also providing sufficient pick-up surface for vacuum pick and place.

For more information see www.autosplice.com

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