Infineon Technologies is offering two new microcontrollers, the XC167CI-16F40F and the XC164CS-8F40F, that are optimised to balance performance and total cost in automotive and industrial drives and control systems. Both of the high-integration microcontrollers feature support for Infineon's embedded Flash program memory and the application-specific peripherals needed for cost-effective motor and transmission controls, high performance electrical motor drives, robotics and industrial networking applications. They are based upon Infineon's C166 architecture, recognised by Gartner Dataquest as one of the industry's most extensively used 16-bit system platforms.
The XC167CI-16F40F's architecture has been optimised for high instruction throughput and minimum response time to external interrupts. Intelligent peripheral systems have been integrated to reduce the need for CPU intervention. The architecture's flexibility supports the requirements of diverse application areas, such as automotive, industrial control and data communications.
Features of both XC167CI-16F40F and the XC164CS-8F40F include the high performance C166 S V2 core, with 25 ns instruction time at 40 MHz, for outstanding overall system performance and compatibility of existing systems software with the existing C166 architecture; high-speed TwinCAN with full CAN 2.0 B, 32 messages and two communication lines for autonomous high-speed communication with gateway functionality; CAPCOM6 module dedicated to PWM generation of AC and DC motor control for simple flexible control of various types of motors; and DSP support with built in advanced MAC unit to provide the signal conditioning and calculation capability required in many complex industrial, automotive and communications applications. An On Chip Debug System (OCDS) is included in both of the new microcontrollers to enable customers to speed time-to-market by accelerating software development and system integration.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version