Electronics Technology


Wireless cellular comms modules ready for integration

20 November 2002 Electronics Technology

If you need your product to be equipped for local or global application, stationary or mobile operation, for processing smaller or larger data volumes, then Siemens is able to offer an appropriate module. The latest cellular engines from Siemens are available in two variants: as modules and as terminals.

These compact modules are suited for integration into individual solutions. Their flat design and tiny size make it easy to integrate them into almost any application.

Because these units have robust housings, universal interfaces and an integrated SIM card reader, the terminals are themselves self-contained plug-and-play solutions, which can be simply and quickly integrated with low installation investment.

Siemens has available:

* Cellular engine TC35/TC35 terminal: This is a dual-band GSM module that has a small lightweight design. It comes as module or plug-and-play terminal.

* Cellular engine MC35/MC35 terminal: This dual-band GSM and GPRS Class 8 comes as module or plug-and-play terminal.

* Cellular engine AC35: dual-band GSM: GPRS Class 8, this is optimised for automotive applications.

* Cellular engine MC45: This is the first tri-band GSM/GPRS module (GPRS Class 10). Super-slim at only 3,5 mm it is especially designed for mobile devices.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
DC-link capacitors with ultra-low inductance
Electrocomp Passive Components
TDK Corporation recently released its new series of MKP DC high-frequency film capacitors, a high-performance DC link capacitor platform for next-generation SiC-based power electronics.

Read more...
What happens when trust can no longer live only in software?
Computer/Embedded Technology Electronics Technology
[Sponsored] For years, many enterprise security architectures treated hardware primarily as the execution layer, while software handled authentication, access control and trust decisions.

Read more...
Non-contact linear position sensor
Electrocomp Test & Measurement
The Vishay 40 LHE Linear Position Sensor, designed for industrial motion control and automation, delivers robust, non-contact measurement performance using Hall effect technology.

Read more...
Compact 1250 V choke solution
Electrocomp Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.

Read more...
Precision in next-gen asset tracking
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX’s advanced antenna technologies have been engineered specifically for compact, high-performance tracking devices.

Read more...
Miniaturised RFID Tags
Electrocomp Telecoms, Datacoms, Wireless, IoT
In the rapidly evolving landscape of Industry 4.0, where precision, resilience, and compact design are more than buzzwords, Neosid is revolutionising identification through its NeoTAG line of RFID transponders.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Robust series of vertical-mating battery connectors
Electrocomp Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.

Read more...
Low-profile tantalum chip capacitors
Electrocomp Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved