Fujitsu Takamisawa has enhanced its fourth-generation signal relay series for telecommunications and data networking applications by adding a through-hole version. The ultraminiature FTR-B3 is a through-hole, flat relay that measures 10,6 x 7,2 x 5,2 mm (H), enabling increased packaging density in compact equipment. Constructed of heat-resistant materials, the relay withstands both infrared reflow and vapour phase soldering methods.
Featuring a high insulation design that meets Telcordia and FCC standards, the relay has a minimum insulation distance of 1,6 mm between coil and contacts, an AC 1,5 kV coil contact withstand voltage, and a 2,5 kV coil contact withstand surge voltage. The FTR-B3 uses a high-efficiency, polar electromagnet that results in low, 140 mW nominal coil power consumption and contributes to the relay's compact design. A power saving (100 mW) latching-type is also available.
The relay meets IEC61811-55 worldwide European standards and IEC60950/UL1950/EN60950 standards for basic insulation, contact spacing and high breakdown voltage. Its operating temperature is -40 to +85°C. It is also available in a surface-mount and reduced surface-mount models.
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