DSP, Micros & Memory


Octal logic-level translators in UCSP package

12 February 2003 DSP, Micros & Memory

Maxim's MAX3000E/MAX3001E/MAX3002-MAX3012 low-voltage, bi/unidirectional, octal, 20 Mbps logic-level translation ICs are packaged in a tiny UCSP. These translators save space and replace up to 10 discrete components. The MAX3000E/1E/02/03 are bidirectional level translation such as SIM/SMART card interfaces, while the MAX3004-MAX3012 are unidirectional level translators.

These devices allow low-voltage ASICs with a supply voltage down to +1,2 V to communicate with higher voltage peripherals with a supply voltage up to +5,5 V. They also permit the reverse communication, ie, higher voltage peripherals to low-voltage ASICs. These ICs facilitate both internal communication within a device such as an ASIC to an analog-to-digital converter (ADC), and external communication such as a cellphone ASIC to a SIM card interface.

The MAX3000E/1E feature ±15 kV ESD protection on the I/O Vcc pins, making them ideal for applications that interact with external devices. These pins are protected using the human body model, ensuring strict compliance with international standards.

The MAX3000E/1E/02-MAX3012 consume only 0,1 µA of quiescent current and feature a shutdown mode in which the I/O pins enter a high-impedance state. The MAX3000E features a slew-rate-limited driver guaranteed to translate data up to 230 Kbps. The MAX3001E, also slew-rate limited, operates up to 4 Mbps; the MAX3002-MAX3012 are guaranteed up to 35 Mbps.

The MAX3000E/1E/02-MAX3012 are available in the extended temperature range (-40 to +85°C) in a tiny 4 x 5 UCSP or 20-pin TSSOP package.



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