26 February 2003Analogue, Mixed Signal, LSI
Access Control & Identity Management
Fujitsu Microelectronics Europe's MB86064 Dual 14-bit 800MSa/s Digital to Analogue Converter (DAC) is the first ASSP based on the company's Next Generation DAC technology. Moving from mixed-signal ASIC solutions to offering an ASSP solution will enable applications where a custom approach is either not required or not justified, says FME. As well as radically improved performance from innovative circuit designs, the product boasts a host of features ranging from the on-chip vector memories, which enhance system integration and test, to next generation segment Shuffling which further improves dynamic performance, it claims. The vector memories enable waveforms to be downloaded and executed on-chip. For device test and evaluation this alleviates the need for a high speed data generator, says the manufacturer, while in a final system application they are ideal for implementing tests on the subsequent analogue signal chain.
General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
Read more...Access & identity expectations for 2024 Technews Publishing IDEMIA ZKTeco Gallagher Salto Systems Africa Regal Distributors SA Reditron
Editor's Choice Access Control & Identity Management Information Security AI & Data Analytics
What does 2024 have in store for the access and identity industry? SMART Security Solutions asked several industry players for their brief thoughts on what they expect this year.
printer friendly version