The MIC-3645 from ProMicro is a 6U-size, high speed SCSI module for Compact PCI systems. It uses the Symbios SYM53C1010-33, PCI to dual channel Ultra3 SCSI multifunction controller to provide an Ultra3 wide SCSI interface. SYM53C1010 supports a 64-bit or 32-bit 33 MHz PCI bus and performs 16-bit, Ultra3 SCSI synchronous data transfers as fast as 160 MBps on each SCSI channel providing a total bandwidth of 320 MBps.
The MIC-3645 can support cables up to 12 m long and up to 16 LVD or SE devices on a wide SCSI bus. Three LEDs on the front panel monitor the operations of the two Ulltra3 SCSI channels as well as the power status. The rear transition board provides two external connectors and two internal connectors for easy system integration. Users can choose the more convenient connection to set up their system.
The interface module supports a variety of operating systems including DOS, Windows NT/2000/98/95, OS/2, SCO UNIX, UnixWare and NetWare.
Next-gen modules for rugged edge AI systems Altron Arrow
Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.
Read more...Fanless multimedia edge PC Vepac Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...Advanced industrial connectivity at the edge Future Electronics
Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.
Read more...A software-based controller for the industrial future Phoenix Contact
Computer/Embedded Technology
With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualised IT environments.
Read more...5G mobile hotspot with integrated multimodal AI capabilities CST Electronics
Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.
Read more...Panasonic TOUGHBOOK 33 2-in-1 detachable Vepac Electronics
Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.
Read more...SBC with 12 TOPS computing power iCorp Technologies
Computer/Embedded Technology
The QSM560DR series is Quectel’s multi-mode 5G smart control panel with built-in Ubuntu/Android/Windows operating system based on the Quectel SG560D series smart module.
Read more...High-performance µC series NuVision Electronics
Computer/Embedded Technology
GigaDevice has announced the official launch of the GD32F503/505 high-performance series of 32-bit general-purpose microcontrollers based on the Arm Cortex-M33 core.
Read more...Octa-core smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
Read more...Vertiv expands rack PDU portfolio
Computer/Embedded Technology
Vertiv has announced its new Vertiv PowerIT rack power distribution units designed to address the rising power needs of data-intensive workloads, including AI and high-performance computing.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version