Verotec has a selection of configured systems plus individual elements such as backplanes, power supplies and cooling products, which are compliant with the PICMG/VITA specifications, and supported by a range of accessories. It offers these on standard VME and CompactPCI platforms across various mechanical form factors, with customisation options to suit specific applications.
Verotec offers a number of standard COTS (commercial off-the-shelf) integrated systems to address the needs of today’s varied industrial computing demands. For VME64/VPX and CompactPCI platforms, it offers Type H, Type D and Type V chassis, each with its own unique form-factor and configuration options. For desktop VPX software and hardware development, the TecSYS chassis is available, and for next-generation carrier grade telecoms applications the A6R ATCA system is offered.
Designed for use in either 19-inch rackmount or desktop applications, the H12 chassis is Verotec’s slimmest horizontal chassis. Fully compliant to IEEE 1101.10/11, the chassis is ideal for housing either VME64x or CompactPCI cards in low board count applications while still maintaining a full-width rear transition capability. It is ideal for development or target/deployable systems requiring minimum space with its robust yet cost-effective design. System cooling is optimised for efficiency with a push-pull configuration, providing sufficient cooling for the demanding requirements of the latest CPU boards when used in a 1U form-factor system. The top cover can easily be removed to provide excellent access, ideal for testing and development activities.
Hardened-grade network switches CST Electronics
Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).
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SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.
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As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.
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Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.
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Test & Measurement
Spectrum Instrumentation has added the Digital Pulse Generator option to its ultrafast digitisers (with up to 10 GS/s speed) and arbitrary waveform generators.
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KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...PCB test points Vepac Electronics
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Maintaining these access points in the final production versions will prove invaluable during the life of the equipment for service, adjustment, and debug, or repair activities.
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During the soldering process, the soldering iron tip undergoes physical changes. These changes, over time, affect the ability of the soldering iron tip to make quality solder connections, and can decrease an operator’s performance.