Arrow Electronics is launching a new learning concept, Tech Snacks, that will provide engineers with the technical information and insight they need in a choice of formats that have been designed to match their demanding schedules.
The Tech Snacks concept will be introduced at an EMEA-wide (Europe, Middle East and Africa) programme that will run from 7-18 June covering a wide range of electronic engineering topics. Individual panel discussions will focus on artificial intelligence and machine learning (AI/ML), automotive/electric vehicles, Industry 4.0 and 5G. The Tech Snacks content is created to appeal to a wide-ranging audience including hardware and software engineers, R&D; teams, project managers and CTOs.
Recognising that not everyone can devote as much time as they would like to join existing online conferences and exhibitions, Arrow has developed a new phased approach to enable attendees to ‘snack’ on overviews of selected topics. Then, on finding an area they would like to explore further, attendees are presented with options to drill down into more detail or interact with experts and other participants who have similar interests. There are no parallel sessions, so participants are never forced to choose between competing activities.
On each day of the programme, visitors can choose from up to five Tech Snacks from across all the event’s headline topics. Each snack is a 15-minute overview that serves as an introduction to a topic and includes a live presentation, introduced and concluded by a host and featuring elements such as interactive polls to help align discussion with audience interest. If, having attended a snack, participants want to learn more, they will be presented with the opportunity to dive more deeply into the topic through detailed presentations, question and answer sessions with experts, discussions on use cases and applications and live demonstrations.
In addition to the snackable content, live Tech Lunch panel discussions will be hosted twice per week. These panels will each focus on one of the programme’s headline topics, selected from AI/ML, automotive/EV, Industry 4.0 and 5G. Leading edge technology and electronics suppliers will attend the panel discussions to share insight on technology trends and roadmaps.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Rooibos heads to space
News
A South African scientific initiative linking agriculture and space research has officially launched today with the Rooibos in Space programme at Parklands College’s Innovation Centre in Cape Town.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...From the editor's desk: Local can be international Technews Publishing
Editor's Choice News
Welcome to the July 2026 issue of Dataweek. As you can see from this introduction, Dataweek’s regular editor, Peter Howells, is on extended leave and I am filling the void in his editor’s column – hopefully without being too boring.
Read more...Landis+Gyr EMEA introduces new company name: EYKON
News
EYKON is the new company name of Landis+Gyr EMEA, formerly part of the Landis+Gyr Group. The company supports electricity, gas, water and thermal utilities in managing increasingly complex networks, improving operational efficiency and enabling more sustainable use of resources.
Read more...Yamaha Robotics will show visitors to EFX
Manufacturing / Production Technology, Hardware & Services News
Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from 6-8 October 2026, how advanced surface-mount automation helps companies grow their business and increase productivity.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version