Print-and-apply cable labelling machines
23 June 2021
Manufacturing / Production Technology, Hardware & Services
If you’re still using old technology, the time to get work done seems to disappear. Old processes slow you down, rework creates bottlenecks and errors can bring things to a full stop. One of the ways to help keep things running smoothly is by automating cable identification.
Brady offers a family of print-and-apply machines that take the manual labelling process out of your hands so you can move through your work more efficiently and with less rework. With these modern automated machines, you can:
•Increase productivity – cut labelling time in half to keep your output numbers high.
•Reduce errors – get sustainable, consistent identification without the rework.
•Make changes fast – intuitive full-colour touchscreen and user interface make changing settings easy.
Wraparound and flag labels can be applied up to 10 seconds faster with Brady’s automated cable identification solutions, which include the Wraptor A6200, Wraptor A6500 and BradyPrinter A5500.
The Wraptor A6200 wrap printer applicator is used for wraparound labels in cellular manufacturing and process-driven assembly. Boasting flexibility in a lightweight, compact size, this new automated labelling device is built to boost efficiency.
The Wraptor A6500 wrap printer applicator significantly increases production output by identifying cables with wraparound labels in 5 s.
With the BradyPrinter A5500 flag printer applicator, operators can significantly increase production output by flagging cables in 5 s.
Dedicated labels are available for maximum reliability when using Brady’s automated identification solutions. The labels themselves are of great quality and can resist challenging industrial environments. All identification materials have been tested using standard ASTM test methods for optimal reliability as described in the technical datasheets.
Further reading:
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...