25 August 2021Manufacturing / Production Technology, Hardware & Services
As it continues to develop innovative solder paste solutions to meet customers’ current and emerging needs, Indium has introduced Indium12.8HF, a versatile paste engineered to deliver exceptional jetting and micro-dispensing performance on a variety of systems.
Indium12.8HF is a no-clean, halogen-free solder paste that is inherently compatible with Indium’s best-selling Indium8.9HF and is optimised for long-term jetting and micro-dispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80 μm.
Additionally, Indium12.8HF:
•Meets IPC J-STD-004B with Amendment 1 ROL0 requirements.
•Offers exceptional electrical reliability.
•Minimises graping and similar reflow issues with a unique flux oxidation barrier formulation.
•Delivers aesthetically pleasing, clear residue with minimal flow-out.
•Provides minimal reflow spatter compared to similar solder pastes.
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