Solder paste technology debate

29 September 2021 Events

Indium Corporation’s Chris Nash, senior product manager for PCB assembly solder paste, will participate in a Global SMT & Packaging debate on solder paste technology on 26 October.

Solder is a critical interconnection material in the electronics manufacturing process. This panel will seek to provide a fundamental guide to all the characteristics that continue to make solder the interconnection of choice for today’s PCB assemblies. This will include paste types, powder sizes, the role of flux chemistries and temperature, among other topics.

The debate will be followed by a live Q&A; session. For more information or to register visit www.dataweek.co.za/*sep21-indium

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