NXP Semiconductors has announced the new BTS6302U/6201U pre-drivers and BTS7203/5 dual-channel receive (RX) front-end modules (FEM) for 5G massive multi-input multi-output (MIMO) infrastructure. These new devices offer low current consumption, reducing carrier operating costs and having been developed using NXP’s silicon germanium (SiGe) process and in-house test and assembly, they offer high levels of integration, reducing system costs for OEMs.
While traditional base stations provide four to eight transmit and receive channels, 5G massive MIMO infrastructure designs typically call for 32 or 64 transmit and receive channels. This allows for increased network throughput and responsiveness, but can also increase costs. By offering a dual-channel solution optimised for low current consumption, NXP RX FEMs address the need for additional channels while simultaneously reducing power needs and operating costs for both carriers and OEMs.
The BTS6302U pre-driver offers optimised 5G performance, with low current consumption and an integrated balun to reduce external components, simplifying design and reducing overall system costs. These new pre-driver and RX FEM devices are also compatible with NXP’s RapidRF series of reference boards, which further reduce 5G development cycles and time to market.
Driving power, defining performance Future Electronics
Power Electronics / Power Management
Vishay’s portfolio of inductors, current sense resistors, and MOSFETs provides a comprehensive solution for intelligent power management.
Read more...Engineered for high-reliability applications Future Electronics
DSP, Micros & Memory
The MCX E series of Arm Cortex-M4F and Arm Cortex-M7 microcontrollers from NXP are engineered for demanding industrial and IoT environments.
Read more...Multiprotocol wireless SoC RF Design
Telecoms, Datacoms, Wireless, IoT
The nRF54LM20A from Nordic Semiconductor is a multiprotocol wireless System-on-Chip designed for demanding designs in Bluetooth devices.
Read more...High performance communication iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s FCS950R is a high-performance Wi-Fi 5 and Bluetooth 4.2 module that can deliver a maximum data rate up to 433,3 Mbps in 802.11ac mode.
Read more...Expanded STM32WL3x line for IoT sensors Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STM32WL31x and STM32WL30x are more tailored versions of the STM32WL33x for designers who wish to focus on specific features, while lowering their bill of materials.
Read more...Processor offers competitive solution for advanced HMIs Future Electronics
DSP, Micros & Memory
The new RZ/A3M microprocessor from Renesas features 128 Mbytes of fast DDR3L DRAM memory for system cost reduction, and supports 1280 x 800 px video resolution at a rate of 30 frames/s.
Read more...Full-band GNSS helical antenna RF Design
Telecoms, Datacoms, Wireless, IoT
A key feature of Calian’s HC3990XF antenna design is that it does not require a ground plane, making it ideal for size-constrained applications.
Read more...BLE and BT Mesh module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The HM-BT4531 from HOPERF is a BLE data transmission module that features an ARM Cortex-M0 32-bit processor.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version