Samtec announced the acquisition of Ultra Communications, a manufacturer of high-speed digital and RF fibre-optic components based in California, USA.
Ultra Communications’ core competencies include circuit design, optoelectronic package design and manufacturing of fibre-optic components. Founded in 2005, the company holds substantial IP and technology, with active programmes in the mil-avionic, space/satellite, ground vehicle, radar and shipboard connectivity arenas.
The acquisition provides Samtec with an opportunity to strengthen and expand its fibre-optic product offering for mil/aero and harsh environment applications. Ultra Communications’ expertise in high-speed mixed-signal circuit design, packaging for high-fidelity electrical and optical coupling and testing at the wafer and component level, combined with Samtec’s advanced interconnect design expertise, will provide advanced product and technology solutions for Samtec’s customers.
Electronic News Digest
News
A brief synopsis of current global news relating to the electronic engineering fields with regards to company finances, general company news, and engineering technologies.
Read more...4000 A containerised DB for power project
News
Power Process Systems has successfully completed the design, fabrication, and commissioning of a 4000 A containerised distribution board for a wind/PV solar hybrid renewable energy project.
Read more...Datacentrix Industrial Indaba 2025
News
Datacentrix recently hosted its inaugural Industrial Indaba 2025, where industry leaders explored how digitalisation, resilience, security and compliance are shaping the future of sustainable industrial operations in Africa.
Read more...RS brings solar light to 150 000 people RS South Africa
News
The company’s three-year partnership with SolarAid aims to raise £1 million through corporate donations, matched funding, product contributions, and fundraising to accelerate access to safe, sustainable energy.
Read more...Microchip and AVIVA Links collaboration Altron Arrow
News
Microchip and AVIVA Links have achieved groundbreaking ASA-ML interoperability, accelerating the shift to open standards for automotive connectivity.
Read more...Low profile spring-loaded connectors Spectrum Concepts
Interconnection
Mill-Max has announced the introduction of low-profile, surface mount additions to its 2 mm pitch spring-loaded connector range.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version