Solderability test system
EMP 2022 Electronics Manufacturing & Production Handbook
Manufacturing / Production Technology, Hardware & Services
MUST System 3 (Multicore Universal Solderability Tester) is a purpose-designed solderability test system. Manufactured by Gen3 Systems, the machine is based on the wetting balance principle, but has been designed to use the microwetting balance method for surface-mounted components. This method also permits more accurate testing of circuit board samples by eliminating the ‘floating’ problem encountered in the bath method. With this method much greater resolution can be obtained by using a solder globule in place of the conventional solder bath.
The measuring head uses a standard LVDT sensor to measure the vertical forces of surface tension and buoyancy acting on the component termination. Contact between the solder and the termination is detected at slow dipping speeds by monitoring the force signal at a high frequency.
The software supplied with the system leads the operator through the test procedure and pass/fail data can be easily obtained at the end of a test or at the end of a series of tests.
Further reading:
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Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.
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